12-inch high-NA EUV masks; Arm's edge AI push; Amkor's expansion; 3D memory; FeRAM startup makes waves; Qualcomm-AWS $60B custom silicon deal; Ayar Labs' scale-up deal; new iPhone chip and format; rogue OpenAI agents in Germany; fab factory; fine-pitch RDL tech for advanced packaging. The
12-inch high-NA EUV masks; Arm's edge AI push; Amkor's expansion; 3D memory; FeRAM startup makes waves; Qualcomm-AWS $60B custom silicon deal; Ayar Labs' scale-up deal; new iPhone chip and format; rogue OpenAI agents in Germany; fab factory; fine-pitch RDL tech for advanced packaging. The post Chip Industry Week in Review appeared first on Semiconductor Engineering .