Femtosecond Laser Process Targets Depth-Controlled 4H-SiC Wafer Slicing (Texas A&M, KIMM, UST)

<p>Researchers from Texas A&#38;M University, KIMM, and UST published a technical paper titled “Self-Focusing Control for Depth-Precise Wafer Slicing of 4H-SiC in Femtosecond Laser Processing.” Abstract Excerpt: &#8220;Femtosecond laser slicing for 4H-SiC wafers offers a non-contact processing appro