<p>Synopsys 3D-IO and the shift to hybrid-bonded 3D integration.</p> <p>The post <a href="https://semiengineering.com/re-architecting-die-to-die-io-for-ai/">Re-Architecting Die-to-Die IO For AI</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>